Routing of inner and outer contours as well as for de-paneling of assembled PCB
Well suited for high Tg up to 185°C and laminate with fillers.
High dimensional accuracy and process capability.
Routing of inner and outer contours as well as for de-paneling of assembled PCB
Well suited for high Tg up to 185°C and laminate with fillers.
High dimensional accuracy and process capability.
Applications / Advantages:
• Routing of inner and outer contours as well as for de-paneling of assembled PCB
• Well suited for high Tg up to 185°C and laminate with fillers
• High dimensional accuracy and process capability