路由的内部和外部轮廓以及depaneling PCB组装
适合高Tg与填料185°C和层压板
高尺寸精度和加工能力
Applications / Advantages:
• Routing of inner and outer contours as well as for de-paneling of assembled PCB
• Well suited for high Tg up to 185°C and laminate with fillers
• High dimensional accuracy and process capability
