路由的內部和外部輪廓以及depaneling PCB組裝
適合高Tg與填料185°C和層壓板
高尺寸精度和加工能力
Applications / Advantages:
• Routing of inner and outer contours as well as for de-paneling of assembled PCB
• Well suited for high Tg up to 185°C and laminate with fillers
• High dimensional accuracy and process capability
