最大限度減少毛剌 : 平滑堅硬表面所提供的強力支撐最大限度，減少了毛剌的產生。
提高鑽孔質量 : 依獨特配方加工合成的樹脂不會沾染鑽孔孔壁。
節約成本 : 物料構成的完美組合大大降低了因去毛剌和清潔孔壁而造成的巨大費用。
密胺板
Application
Circuit Board Drilling, Flexible Circuit Board Double Sided, Surface Mount, Back-Plane, High-Density Interconnect MLB, Chip Packaging – BGA
Features
- Minimizes Burring – Provides a flat, hard surface for maximum support to minimize burring.
- Increase Hole Quality – Premium quality materials that will not contaminate the hole wall.
- Reduces Drilling Temperatures – Offers excellent heat dissipation characteristics resulting in reduced drill wear and minimized heat-related hole defect.
