Application

Circuit Board Drilling, Flexible Circuit Board Double Sided, Surface Mount, Back-Plane, High-Density Interconnect MLB, Chip Packaging – BGA

Features

• Minimizes Burring – Provides a flat, hard surface for maximum support to minimize burring.
• Increase Hole Quality – Premium quality materials that will not contaminate the hole wall.
• Reduces Drilling Temperatures – Offers excellent heat dissipation characteristics resulting in reduced drill wear and minimized heat-related hole defect.