最大限度减少毛剌 : 平滑坚硬表面所提供的强力支撑最大限度，减少了毛剌的产生。
提高钻孔质量 : 依独特配方加工合成的树脂不会沾染钻孔孔壁。
节约成本 : 物料构成的完美组合大大降低了因去毛剌和清洁孔壁而造成的巨大费用。
密胺板
Application
Circuit Board Drilling, Flexible Circuit Board Double Sided, Surface Mount, Back-Plane, High-Density Interconnect MLB, Chip Packaging – BGA
Features
- Minimizes Burring – Provides a flat, hard surface for maximum support to minimize burring.
- Increase Hole Quality – Premium quality materials that will not contaminate the hole wall.
- Reduces Drilling Temperatures – Offers excellent heat dissipation characteristics resulting in reduced drill wear and minimized heat-related hole defect.
