产品介绍
牛皮纸
Paper pad是针对PCB/FPC行业推出的一款高分子材料组成的优异产品，其有效解决了PCB/FPC层压过程中使用牛皮纸出现的各种问题，如压力均匀性、升温及热传导差异、层压清洁环境等问题
Paper pad is a high-performance product composed of polymer materials launched for the PCB/FPC industry. It effectively addresses the various issues arising from the use of kraft paper during the PCB/FPC lamination process, such as problems related to pressure uniformity, variations in temperature rise and heat conduction, and cleanliness in the lamination environment.
产品特性product feature
- 导电性能强
High electrical conductivity - 具有较强的耐磨性、弹性、结构强度，能适应各种PCB产品
It possesses high wear resistance, elasticity, and structural strength, and can accommodate a wide range of PCB products. - 精度高High Precision
- 耐温性、耐腐蚀性、抗湿性
Temperature Resistance，Corrosion Resistance，Moisture Resistance
